3D manufacturing procedure empowers more rational electronics production

Chips must be all around secured with the goal that they are protected from environmental impacts. In the meantime, the right housing must guarantee working contacts with the outside world. With a new technology, housing and contacting of the components can be created independently for the respective application reason.

For what reason do electronic components dependably must be soldered to a printed circuit board? Couldn’t these components be integrated directly into the chip housing instead? Tobias Tiedje, a researcher at the Technical University of Dresden, posed this inquiry. With his group, the researchers built up a manufacturing approach that recoveries around half of the usual procedure and design steps and in the meantime better copes with the current challenges of high information transmission, cooling and miniaturization. The most changed sorts of components and formed parts as well as structures (cavities and microchannels) can be utilized. They called their new technology KONEKT (“Contacting of embedded components as a technology solution”).

KONEKT revolutionizes the creation of electronic and microtechnical assemblies by utilizing 3D manufacturing technology. The aim is to combine the advantages of mass production with the adaptability of individual creation. Simplified procedures empower quick and automated creation of optimized assemblies through the high-frequency connection of the respective components. In the meantime, procedure, energy and material costs are significantly lower.

This gives medium-sized organizations specifically the chance to build up new business fields through quick electronic manufacturing or the creation of individual assemblies without high set-up expenses. “With KONEKT, a wide variety of products can be realized in production,” explains team leader Tobias Tiedje. “From 3D sensor assemblies as prototypes to RFID and high-frequency assemblies in series for the Internet of Things (IoT). The new technology offers users many design options without restricting their creativity”.

The group around KONEKT had the option to raise 807,000 euros up in subsidizing from the Federal Ministry of Economics and Energy and the European Social Fund as a major aspect of the EXIST program. Presently the foundation of an independent organization is on the motivation to empower the future production of adaptively manufactured 3D assemblies in market-ready sizes and to offer small and medium-sized companies “packaging as a service”.